| 产品编码 |
26829 |
| 产品描述 |
1.27mm 排母,双排,立贴,塑高4.3mm,塑宽3.0mm,D4.8mm,U型,6T料,Au足1u＂,2x30P |
| 在产状态 |
正常
|
| 星坤兼容 |
|
| 商品毛重 |
1.590( 不含包装 ) |
| 商品毛重 |
1.590 |
| 操作 |
申请样品 联系客服 |
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| 经销商 |
经销商名称 |
MPQ |
MOQ |
库存 |
购买 |
|
立创江苏仓 |
|
|
298 |
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|
|
|
立创深圳仓 |
|
|
26 |
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|
Material
Contact Material: Copper Alloy
Standard Insulator Material:PA6T, UL94 V-0
Plating
Underplating: 50-100µ" Nickel
Where specified tin plating thickness 80µ" minimum
Contact Plating: Gold Flash, Selective Gold Flash, Tin, 10µ" Selective Gold, 30µ" Selective Gold
Electrical
Current Rating: 1 AMP
Contact Resistance: 20mΩ Max.
Insulation resistance: 1000 MΩ MIN.
Dielectric withstanding voltage: AC 300 V
Environmental and Processing
Operating Temperature: -40°C to +105°C
PA6T Suitable For: IR Reflow, Wave, Manual solder
Material
Contact Material: Copper Alloy
Standard Insulator Material:PA6T, UL94 V-0
Plating
Underplating: 50-100µ" Nickel
Where specified tin plating thickness 80µ" minimum
Contact Plating: Gold Flash, Selective Gold Flash, Tin, 10µ" Selective Gold, 30µ" Selective Gold
Electrical
Current Rating: 1 AMP
Contact Resistance: 20mΩ Max.
Insulation resistance: 1000 MΩ MIN.
Dielectric withstanding voltage: AC 300 V
Environmental and Processing
Operating Temperature: -40°C to +105°C
PA6T Suitable For: IR Reflow, Wave, Manual solder
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